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PMEG2010AEH; PMEG2010AET
1 A very low VF MEGA Schottky barrier rectifiers
Rev. 03 -- 28 March 2007 Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview Package NXP PMEG2010AEH PMEG2010AET SOD123F SOT23 JEITA single single Configuration
Type number
1.2 Features
I I I I Forward current: IF 1 A Reverse voltage: VR 20 V Very low forward voltage Small SMD plastic packages
1.3 Applications
I I I I I Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Reverse polarity protection Low power consumption applications
1.4 Quick reference data
Table 2. Symbol IF VR VF
[1]
Quick reference data Parameter forward current reverse voltage forward voltage IF = 1 A
[1]
Conditions Tsp 55 C
Min -
Typ 380
Max 1 20 430
Unit A V mV
Pulse test: tp 300 s; 0.02.
NXP Semiconductors
PMEG2010AEH; PMEG2010AET
1 A very low VF MEGA Schottky barrier rectifiers
2. Pinning information
Table 3. Pin SOD123F 1 2 cathode anode
[1]
Pinning Description Simplified outline Symbol
1 1 2
2
sym001
SOT23 1 2 3 anode not connected cathode
1 2 3 1 3 2 n.c.
006aaa436
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 4. Ordering information Package Name PMEG2010AEH PMEG2010AET Description plastic surface-mounted package; 2 leads plastic surface-mounted package; 3 leads Version SOD123F SOT23 Type number
4. Marking
Table 5. Marking codes Marking code[1] AF *AX Type number PMEG2010AEH PMEG2010AET
[1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
PMEG2010AEH_PMEG2010AET_3
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 -- 28 March 2007
2 of 11
NXP Semiconductors
PMEG2010AEH; PMEG2010AET
1 A very low VF MEGA Schottky barrier rectifiers
5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF IFRM Parameter reverse voltage forward current repetitive peak forward current PMEG2010AEH PMEG2010AET IFSM Ptot non-repetitive peak forward current total power dissipation PMEG2010AEH PMEG2010AET Tj Tamb Tstg
[1] [2]
Conditions Tsp 55 C tp 1 ms; 0.25
Min -
Max 20 1
Unit V A
square wave; tp = 8 ms Tamb 25 C
[1] [2] [1] [2]
7 6 9
A A A
-
-65 -65
375 830 280 420 150 +150 +150
mW mW mW mW C C C
junction temperature ambient temperature storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient PMEG2010AEH PMEG2010AET Rth(j-sp) thermal resistance from junction to solder point PMEG2010AEH PMEG2010AET
[1] [2] [3] [4]
Conditions in free air
[1]
Min
Typ
Max
Unit
[2] [3] [2] [3] [4]
-
-
330 150 440 300
K/W K/W K/W K/W
-
-
60 120
K/W K/W
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Soldering point of cathode tab.
PMEG2010AEH_PMEG2010AET_3
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 -- 28 March 2007
3 of 11
NXP Semiconductors
PMEG2010AEH; PMEG2010AET
1 A very low VF MEGA Schottky barrier rectifiers
7. Characteristics
Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol VF Parameter forward voltage IF = 10 mA IF = 100 mA IF = 1 A IR reverse current VR = 5 V VR = 10 V VR = 20 V Cd
[1]
Conditions
[1]
Min -
Typ 200 265 380 15 20 50 55
Max 220 290 430 50 80 200 70
Unit mV mV mV A A A pF
diode capacitance
Pulse test: tp 300 s; 0.02.
VR = 5 V; f = 1 MHz
PMEG2010AEH_PMEG2010AET_3
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 -- 28 March 2007
4 of 11
NXP Semiconductors
PMEG2010AEH; PMEG2010AET
1 A very low VF MEGA Schottky barrier rectifiers
104 IF (mA) 103
mdb823
IR (A)
105 104 103
(1) (2)
006aab033
102
(1)
(2)
(3)
(4)
102 10
(3)
10
1 10-1
1 10-2 10-1 10-3 0 5 10 15 VR (V) 20
(4)
0
0.1
0.2
0.3
0.4
VF (V)
0.5
(1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C (4) Tamb = -40 C
(1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C (4) Tamb = -40 C
Fig 1. Forward current as a function of forward voltage; typical values
Fig 2. Reverse current as a function of reverse voltage; typical values
mdb824
200 Cd (pF) 150
100
50
0
0
5
10
15
VR (V)
20
f = 1 MHz; Tamb = 25 C
Fig 3. Diode capacitance as a function of reverse voltage; typical values
PMEG2010AEH_PMEG2010AET_3
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 -- 28 March 2007
5 of 11
NXP Semiconductors
PMEG2010AEH; PMEG2010AET
1 A very low VF MEGA Schottky barrier rectifiers
8. Test information
t1 t2
P t2 t1
duty cycle =
t
006aaa812
Fig 4. Duty cycle definition
9. Package outline
1.7 1.5 1
3
1.2 1.0
3.0 2.8
1.1 0.9
0.55 0.35 3.6 3.4 2.7 2.5 2.5 1.4 2.1 1.2
0.45 0.15
1
2
2 0.70 0.55 Dimensions in mm 0.25 0.10 04-11-29 Dimensions in mm 1.9
0.48 0.38
0.15 0.09 04-11-04
Fig 5. Package outline SOD123F
Fig 6. Package outline SOT23 (TO-236AB)
10. Packing information
Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMEG2010AEH PMEG2010AET
[1]
Package SOD123F SOT23
Description 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115 -215 10000 -135 -235
For further information and the availability of packing methods, see Section 14.
PMEG2010AEH_PMEG2010AET_3
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 -- 28 March 2007
6 of 11
NXP Semiconductors
PMEG2010AEH; PMEG2010AET
1 A very low VF MEGA Schottky barrier rectifiers
11. Soldering
4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2x)
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 7. Reflow soldering footprint SOD123F
PMEG2010AEH_PMEG2010AET_3
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 -- 28 March 2007
7 of 11
NXP Semiconductors
PMEG2010AEH; PMEG2010AET
1 A very low VF MEGA Schottky barrier rectifiers
2.90 2.50
0.85 3.00 0.85 1.30
2
1
solder lands
2.70
3
solder resist
solder paste
occupied area
0.60 (3x)
Dimensions in mm
0.50 (3x) 0.60 (3x) 1.00 3.30
sot023
Fig 8. Reflow soldering footprint SOT23 (TO-236AB)
3.40 1.20 (2x)
solder lands solder resist occupied area
2 1 3
4.60 4.00 1.20
Dimensions in mm 2.80 4.50
preferred transport direction during soldering
sot023
Fig 9. Wave soldering footprint SOT23 (TO-236AB)
PMEG2010AEH_PMEG2010AET_3
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 -- 28 March 2007
8 of 11
NXP Semiconductors
PMEG2010AEH; PMEG2010AET
1 A very low VF MEGA Schottky barrier rectifiers
12. Revision history
Table 10. Revision history Release date Data sheet status Product data sheet Change notice Supersedes PMEG2010AEH_2 Document ID Modifications:
PMEG2010AEH_PMEG2010AET_3 20070328
* * * * * * * * * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Type number PMEG2010AET added Section 1.1 "General description": amended Table 1 "Product overview": added Table 7 "Thermal characteristics": Table note 1 amended Table 7 "Thermal characteristics": Table note 4 added Table 8 "Characteristics": Cd diode capacitance conditions adapted Figure 2: amended Section 8 "Test information": added Section 13 "Legal information": updated Product data sheet Product data sheet PMEG2010AEH_1 -
PMEG2010AEH_2 PMEG2010AEH_1
20050526 20050406
PMEG2010AEH_PMEG2010AET_3
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 -- 28 March 2007
9 of 11
NXP Semiconductors
PMEG2010AEH; PMEG2010AET
1 A very low VF MEGA Schottky barrier rectifiers
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
13.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
PMEG2010AEH_PMEG2010AET_3
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 -- 28 March 2007
10 of 11
NXP Semiconductors
PMEG2010AEH; PMEG2010AET
1 A very low VF MEGA Schottky barrier rectifiers
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 28 March 2007 Document identifier: PMEG2010AEH_PMEG2010AET_3

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